With the development of integrated circuit chips and electronic information technology, the specifications of many built-in electronic components continue to become smaller. At this stage, built-in electronic components have grown from 1005 to 0603.

At the same time, BGA, CSP/BGA, FC, MCM The emergence and application of electronic components in the form of encapsulation in large numbers, as the key component of its access process and the interface installation process of the main process.

According to years of development and growth, this has already become a key technical means for the interconnection of PCB circuit components in contemporary electronic and electrical enterprise products. Relevant information shows that the penetration rate of SMT in developed countries has exceeded 80%, and it has further developed into the field of installation technology represented by high-density installation and three-dimensional installation.

Circuit boards range from single-layer boards to 4-layer, 8-layer, and even multi-layer boards. There are often many electronic components on one CM2. Especially nowadays, the development and design of enterprise products are becoming more and more concerned about the possible impact of temperature on product quality. With a thermal imaging camera, you can get full control while designing.

Many engineers will complain that the current method cannot carry out a detailed and comprehensive description of the temperature field, such as the detection of the surface temperature distribution when the PCB is used for ambient temperature, and the use of patch thermocouples is inconvenient and must wait until the circuit board is used. Turn off the power, the number of patches is not enough, and the operation is very inconvenient.

Using an infrared thermal imaging camera, there is no need to touch or turn off the power. With just one touch, the desired image can be captured. At the same time, specific thermodynamic analysis can be carried out according to the software, and a report can be formed.

When companies are testing products, in addition to conventional testing methods, they can also use thermal imaging cameras to test circuit boards. According to the different temperature points displayed, they can grasp the specific conditions of the current and voltage that the components are subjected to.

In some maintenance occasions, such as the rapid maintenance tool for short-circuit fault boards, the thermal imager can quickly locate the short-circuit fault point in the board without the need for a circuit diagram, so as to facilitate further processing.

In the system design of the entire electrical product, the design of heat dissipation components, such as heat sinks, heat dissipation holes, and fans, is often carried out according to specific conditions, and the distribution of its temperature field must be grasped at any time for selection. With the use of thermal imaging cameras, the results can be easily obtained, and the conditions of its heat transfer (heat transfer, radiation, convection) can be grasped quantitatively, so as to make improvements.

If you want to learn more about the application of thermal imaging cameras after reading the above content, please refer to our previous news.

As a professional manufacturer of thermal imaging cameras, ThermTec always puts the needs of customers first and strictly controls the design and quality of its products. Our products are sold all over the world and have received praise and trust from many customers. We can also provide users with thoughtful one-stop shopping services and effective solution technology. If you want to buy our thermal imaging camera, please contact us immediately!